LOW-PRESSURE OVERMOLDING AND ENCAPSULATION

ENCAPSULATION
WHY IT WORKS WITH RIM
WHEN TO ENCAPSULATE

REACTION INJECTION OVERMOLDING & ENCAPSULATION

ADVANTAGES OF THE RIM LOW-PRESSURE OVERMOLDING PROCESS

In reaction injection molding, overmolding and encapsulation with RIM allows for reliable, structural ‘one-piece’ solutions wherever added functionality is needed. Encapsulation and overmolding services also create an ideal solution for sensitive equipment that requires protection from the environment. Components to be encapsulated are fully or partially surrounded by the molded part. This provides the structural and cosmetic properties of the finished unit.

WHY LOW-PRESSURE OVERMOLDING WORKS

  • Circuit Boards: will not be damaged by the molding process
  • Batteries: will maintain their capacity
  • Antennas: will maintain or improve their radio signal
  • Magnets: magnets that are inserted into the mold can be readily encapsulated
  • Metal Rods, Bolts & Clips: anchored right into the part
  • Threaded Inserts: for attachments of assembly parts

BENEFITS OF LOW-PRESSURE OVERMOLDING

Low exothermic heat coupled with low process pressure allows for the encapsulation of sensitive circuit boards and batteries.

Polyurethane, the material created by the RIM process, is also a natural glue. Thus, it will adhere to almost all other materials and ensure an excellent bond. No matter if you need impact resistance, chemical resistance, or the part to float in water – chances are, there is a RIM material to meet the requirements.

WHEN IS THE REACTIVE ENCAPSULATION OVERMOLDING PROCESS THE RIGHT APPROACH?

HERE ARE A FEW THINGS TO CONSIDER

  • Do you have sensitive equipment and need to protect it from dirt, oil, grease, or chemicals?
  • Does your equipment need to be sealed against moisture? Is it being used in wet conditions or underwater?
  • Do you need to protect the component from impacts or other mechanical abuse?
  • In other words—is the part subject to a harsh environment?
  • Would you like to incorporate additional functions without a secondary assembly process?
  • How about simplifying the manufacturing process with a single-piece-solution?