Encapsulation and Overmolding with RIM

Encapsulation and Overmolding with RIM provides for reliable, structural 'one-piece' solutions wherever added functionality is needed or where sensitive equipment needs protection from the environment. Components to be encapsulated are fully or partially surrounded by the molded part which provides for the structural and cosmetic properties of the finished unit.

Encapsulation with RIM

Why it works with RIM

The low exothermic heat, and low process pressure produced, allows for encapsulation of sensitive circuit boards and batteries.

Polyurethane, the material created by the RIM process, is also a natural glue and will adhere to almost all other materials, ensuring an excellent bond. No matter if you need impact resistance, chemical resistance or the part to float in water - chances are, there is a RIM material to meet the requirements.

When to encapsulate

Here are a few things to consider